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| TDA8172 TV VERTICAL DEFLECTION OUTPUT CIRCUIT . . . POWER AMPLIFIER FLYBACK GENERATOR THERMAL PROTECTION DESCRIPTION The TDA8172 is a monolithic integrated circuit in HEPTAWATTTM package. It is a high efficiency power booster for direct driving of vertical windings of TV yokes. It is intended for use in Color and B & W television as well as in monitors and displays. PIN CONNECTIONS (top view) 7 6 5 4 3 2 1 NON-INVERTING INPUT OUTPUT STAGE SUPPLY OUTPUT GROUND FLYBACK GENERATOR SUPPLY VOLTAGE INVERTING INPUT HEPTAWATT (Plastic Package) ORDER CODE : TDA8172 Tab connected to Pin 4 BLOCK DIAGRAM + VS 2 6 3 FLYBACK GENERATOR 1 POWER AMPLIFIER 5 THERMAL P ROTECTION 7 TDA8172 4 YOKE May 1996 1/5 8172-02.EPS 8172-01.EPS TDA8172 ABSOLUTE MAXIMUM RATINGS Symbol VS V5 , V6 V3 V1 , V7 Io Io Io I3 I3 Ptot Tstg, Tj Supply Voltage (pin 2) Flyback Peak Voltage Voltage at Pin 3 Amplifier Input Voltage Output Peak Current (non repetitive, t = 2 ms) Output Peak Current at f = 50 or 60 Hz, t 10 s Output Peak Current at f = 50 or 60 Hz, t > 10 s Pin 3 DC Current at V5 < V2 Pin 3 Peak to Peak Flyback Current at f = 50 or 60 Hz, tfly 1.5 ms Total Power Dissipation at Tcase = 90 C Storage and Junction Temperature Parameter Value 35 60 + Vs + Vs - 0.5 2.5 3 2 100 3 20 - 40, +150 V A A A mA A W C 8172-01.TBL 8172-03.TBL 8172-02.TBL Unit V V THERMAL DATA Symbol Rth (j-c) Parameter Thermal Resistance Junction-case Max. Value 3 Unit C/W ELECTRICAL CHARACTERISTICS (refer to the test circuits, VS = 35V, Tamb = 25oC unless otherwise specified) Symbol I2 I6 I1 V3L V5 V5L V5H Tj Parameter Pin 2 Quiescent Current Pin 6 Quiescent Current Amplifier Input Bias Current Pin 3 Saturation Voltage to GND Quiescent Output Voltage Output Saturation Voltage to GND Output Saturation Voltage to Supply Junction Temperature for Thermal Shut Down Test Conditions I3 = 0, I5 = 0 I3 = 0, I5 = 0 V1 = 1 V, V7 = 2 V V1 = 2 V, V7 = 1 V I3 = 20 mA Vs = 35V, Ra = 39 k I5 = 1.2 A I5 = 0.7 A - I5 = 1.2 A - I5 = 0.7 A Min. Typ. 8 16 - 0.1 - 0.1 1 18 1 0.7 1.6 1.3 140 1.4 1 2.2 1.8 Max. 16 36 -1 -1 1.5 Unit Fig. mA mA A A V V V V V V C 1a 1a 1a 1a 1c 1d 1c 1c 1b 1b 2/5 TDA8172 Figure 1 : DC Test Circuits. Figure 1 a : Measurement of I1 ; I2 ; I6 VS I2 2 6 5 10k S1 1 7 4 b I1 V7 1V 8172-03.EPS Figure 1 b : Measurement of V5H VS 2 6 V5H 1 1V 7 V7 4 I5 8172-04.EPS I6 5 a S1 : (a) I2 and I6 ; (b) I1 Figure 1 c : Measurement of V3L ; V5L VS I 3 or I 5 2 6 3 b 1 3V 5 7 V7 4 V 3L V 5L 8172-05.EPS Figure 1 d : Measurement of V5 VS 2 6 S1 12k a 2V 1 5 7 V7 Ra 4 V5 S1 : (a) V3L ; (b) V5L 3/5 8172-06.EPS 5.6k TDA8172 Figure 2 : AC Test Circuit 1N4001 VS C1 0.1F C2 470F C3 220F D1 t fly 2 VREF Vi 6 3 Iy 7 V7 to Ly 24.6mH GND R1 1 10k TDA8172 4 5 C4 0.22F R7 1.5 R4 R6 330 Ry 9.6 to RT1 4.7k R3 IN R2 5.6k 12k C6 4.7F 8.2k C5 2200F R 5 Iy 8172-07.EPS 8172-08.EPS - 8172-09.EPS *Re comme nde d for VREF filtering R5 8.2 to MOUNTING INSTRUCTIONS The power dissipated in the circuit must be removed by adding an external heatsink. Thanks to the HEPTAWATTTM package attaching the heatsink is very simple, a screw or a compression spring (clip) being sufficient. Figure 3 : Mounting Examples Between the heatsink and the package it is better to insert a layer of silicon grease, to optimize the thermal contact ; no electrical isolation is needed between the two surfaces, since the tab is connected to Pin 4 which is ground. 4/5 TDA8172 PACKAGE MECHANICAL DATA : 9 PINS - PLASTIC HEPTAWATT Dimensions A C D D1 E F F1 G G1 G2 H2 H3 L L1 L2 L3 L5 L6 L7 M M1 Dia. Min. Millimeters Typ. 2.4 1.2 0.35 0.6 2.41 4.91 7.49 10.05 16.97 14.92 21.54 22.62 2.6 15.1 6 2.8 5.08 3.65 2.54 5.08 7.62 Max. 4.8 1.37 2.8 1.35 0.55 08 0.9 2.67 5.21 7.8 10.4 10.4 Min. Inches Typ. 0.094 0.047 0.014 0.024 0.095 0.193 0.295 0.396 0.668 0.587 0.848 0.891 0.100 0.200 0.300 Max. 0.189 0.054 0.110 0.053 0.022 0.031 0.035 0.105 0.205 0.307 0.409 0.409 3 15.8 6.6 0.102 0.594 0.236 0.110 0.200 0.118 0.622 0.260 HEPTV.TBL 3.85 0.144 0.152 Information furnished is believed to be accurate and reliable. However, SGS-THOMSON Microelectronics assumes no responsibility for the consequences of use of such information nor for any infringement of patents or other rights of third parties which may result from its use. No licence is granted by implication or otherwise under any patent or patent rights of SGS-THOMSON Microelectronics. Specifications mentioned in this publication are subject to change without noti ce. This publication supersedes and replaces all information previously supplied. SGS-THOMSON Microelectronics products are not authorized for use as critical components in life support devices or systems without express written approval of SGS-THOMSON Microelectronics. (c) 1996 SGS-THOMSON Microelectronics - All Rights Reserved Purchase of I2C Components of SGS-THOMSON Microelectronics, conveys a license under the Philips I2C Patent. Rights to use these components in a I2C system, is granted provided that the system confo rms to the I2C Standard Specifications as defined by Philips. SGS-THOMSON Microelectronics GROUP OF COMPANIES Australia - Brazil - Canada - China - France - Germany - Hong Kong - Italy - Japan - Korea - Malaysia - Malta - Morocco The Netherlands - Singapore - Spain - Sweden - Switzerland - Taiwan - Thailand - United Kingdom - U.S.A. 5/5 PM-HEPTV.EPS |
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